Palladium diffusion into bulk copper via the (100) surface
Abstract
Using low-energy electron microscopy, we measure the diffusion of Pd into bulk Cu at the Cu(100) surface. Interdiffusion is tracked by measuring the dissolution of the Cu(100)-c(2 x 2)-Pd surface alloy during annealing (T > 240 degrees C). The activation barrier for Pd diffusion from the surface alloy into the bulk is determined to be (1.8 +/- 0.6) eV. During annealing, we observe the growth of a new layer of Cu near step edges. Under this new Cu layer, dilute Pd remaining near the surface develops a layered structure similar to the Cu(3)Pd L1(2) bulk alloy phase.
Department
Physics
Publication Date
7-7-2009
Journal Title
Journal of Physics-Condensed Matter
Publisher
IOP PUBLISHING LTD
Digital Object Identifier (DOI)
10.1088/0953-8984/21/31/314016
Document Type
Article
Recommended Citation
Bussman, E.; Sun, J.; Pohl, Karsten; and Kellogg, G. L., "Palladium diffusion into bulk copper via the (100) surface" (2009). Journal of Physics-Condensed Matter. 89.
https://scholars.unh.edu/physics_facpub/89
Rights
© 2009 IOP Publishing Ltd
