Date of Award

Spring 2013

Project Type


Program or Major

Mechanical Engineering

Degree Name

Master of Science

First Advisor

Brad Kinsey


The goal of this research was to investigate Electrically-Assisted Forming (EAF) at the microscale. Past research has suggested that EAF has the potential to overcome microforming difficulties (i.e., increased data scatter caused by the individual grains affecting the global material properties). In this thesis, three point bending results are presented for both classical (non-EA) and EA processes with CuZn30 specimens containing different grain sizes. A more uniform strain distribution was achieved with the EA processes. Although the application of current did not result in the expected forming force reduction, a decrease was observed where a temperature spike occurred (believed to be caused by varying electrical contact).

In addition to the microbending tests, stationary copper wire temperature tests under compression were also performed. Past research had shown the effect of grain size and Zn content during EAF. However, temperature data of the specimens during the tests was not available.