We report progress in the study of thick CZT strip detectors for 3-D imaging and spectroscopy and discuss two approaches to device design. Unlike double-sided strip detectors, these devices feature both row and column contacts implemented on the anode surface. This electron-only approach circumvents problems associated with poor hole transport in CZT that normally limit the thickness and energy range of double-sided strip detectors. The work includes laboratory and simulation studies aimed at developing compact, efficient, detector modules for 0.05 to 1 MeV gamma radiation measurements while minimizing the number and complexity of the electronic readout channels. These devices can achieve similar performance to pixel detectors for both 3-D imaging and spectroscopy. The low channel count approach can significantly reduce the complexity and power requirements of the readout electronics. This is particularly important in applications requiring large area detector arrays. We show two single-sided strip detector concepts. One, previously reported, features rows established with collecting contacts and columns with noncollecting contacts. Another, introduced here, operates on a charge sharing principle and establishes both rows and columns with collecting contacts on the anode surface. In previous work using the earlier strip detector concept we reported simulations and measurements of energy and spatial resolution for prototype 5- and 10-mm-thick CZT detectors. We now present the results of detection efficiency and uniformity measurements conducted on 5-mm-thick detectors using a specific configuration of the front-end electronics and event trigger. We discuss the importance of the detector fabrication processes when implementing this approach.
Nuclear Science Symposium Conference Record, 2004 IEEE
Digital Object Identifier (DOI)
Macri, J.R.; Hamel, L.-A.; Julien, M.; Miller, R.S.; Donmez, B.; McConnell, M.L.; Ryan, J.M.; Widholm, M., "Single-sided CZT strip detectors," Nuclear Science, IEEE Transactions on , vol.51, no.5, pp.2453,2460, Oct. 2004
© 2004 IEEE