Date of Award
Program or Major
Master of Science
Dale P Barkey
An experimental study on the effect of additives used in a copper via-filling chemistry is carried out by electroanalytical techniques. These include potential or current pulse reversal deposition and cyclic voltammetry methods. Suppression of electrodeposition caused by polyethylene glycol (PEG) and by a commercial suppressor was examined. Effect of bis-(3-sulfopropyl)-disulfide (SPS) and a combination with the suppressor was also examined. A model based on free accelerant complex formation was used to design the experiments. Contrast in the chemical environment between the bottom and the surface of the vias was simulated on a rotating disk electrode (RDE) by variation of rotation speeds. The currents measured at low and high speeds of RDE simulate the bottom and top of the via respectively. The fill ratio, current at low speed divided by current at high speed, was used an effective screening tool to compare baths with different additive chemistries.
Usman Ibrahim, Sheik Ansar, "Study of additives used in a copper via filling chemistry" (2009). Master's Theses and Capstones. 482.